Thermal mode refers to the main way that the radiator emits heat. In thermodynamics, heat dissipation is heat transfer, and there are three main ways of heat transfer: heat conduction, heat convection and heat radiation. When matter itself or when it comes into contact with matter, the transfer of energy is called heat conduction, which is the most common way of heat transfer. For example, the way that CPU radiator base contacts CPU directly to take away heat belongs to heat conduction. Heat convection refers to the heat transfer mode that the flowing fluid (gas or liquid) moves the tropics. In the heat dissipation system of the computer case, the "forced heat convection" heat dissipation mode, which is driven by the heat dissipation fan, is more common. Thermal radiation refers to the transfer of heat by radiation, the most common daily is solar radiation. These three ways of heat dissipation are not isolated. In daily heat transfer, these three ways of heat dissipation occur at the same time and work together. Integrative radiator

In fact, any type of radiator will basically use the above three heat transfer modes at the same time, but with different emphasis. For example, the ordinary CPU radiator, CPU radiator and CPU surface directly contact, the heat of CPU surface is transmitted to CPU radiator through heat conduction; the fan generates airflow through heat convection to take away the heat of CPU radiator surface; and the air flow in the chassis is also through heat convection to take away the heat of air around CPU radiator until outside the chassis; at the same time, all the parts with high temperature will be outside the chassis; Thermal radiation occurs in the low temperature part of the surroundings. Integrative radiator

The radiation efficiency of the integrated radiator is related to the heat conductivity of the radiator material, the heat capacity of the radiator material and the radiator medium, and the effective radiation area of the radiator. According to the way of taking heat away from the radiator, the radiator can be divided into active and passive heat dissipation, the former is commonly air-cooled radiator, and the latter is commonly radiator. Further subdivision of heat dissipation can be divided into air cooling, heat pipe, liquid cooling, semiconductor refrigeration and compressor refrigeration and so on.

Air-cooled heat dissipation is common and simple, that is, the use of fans to take away the heat absorbed by the radiator. It has the advantages of relatively low price and simple installation, but it is highly dependent on the environment. For example, when the temperature rises and overfrequency, its heat dissipation performance will be greatly affected.

Heat pipe is a heat transfer element with high thermal conductivity. It transfers heat through evaporation and condensation of liquid in a fully enclosed vacuum tube. It uses fluid principles such as capillary absorption to achieve refrigeration effect similar to refrigerator compressor. It has a series of advantages, such as high thermal conductivity, good isotherm, arbitrary change of heat transfer area on both sides of the cold and hot, long-distance heat transfer, temperature control and so on. The heat exchanger composed of heat pipes has the advantages of high heat transfer efficiency, compact structure and low fluid resistance. Because of its special heat transfer characteristics, the tube wall temperature can be controlled to avoid dew point corrosion.

Liquid cooling is the use of liquid driven by the pump forced circulation to take away the heat of the radiator. Compared with air cooling, it has the advantages of quiet, stable cooling, less dependence on the environment and so on. But the price of heat pipe and liquid cooling is relatively high, and installation is relatively troublesome. Integrative radiator

When choosing radiators, they can be purchased according to their actual needs and economic conditions. The principle is that they are sufficient.